Hisense Photonics Inc. is a high-tech chip design and manufacturing company located in South Plainfield, NJ. Hisense Photonics offers a full portfolio of semiconductor laser products including FP, DFB, EML, and SOA-based integrated chips, reaching speeds up to 56 Gps.

A Process Integration Engineer will lead the manufacturing and process development of III-V laser products. The primary responsibility will be to identify and resolve device performance and yield anomalies pertinent to wafer fabrication.

Responsibilities:

· Define process flow and mask layout for manufacturing of III-V semiconductor lasers

· Plan, monitor and control all phases of manufacturing processes in house

· Collaborate with epi, design, process, equipment and product engineering teams to maintain process stability and improve yield

· Identify process weaknesses and fabrication tool issues, propose and implement solutions for corrective actions

· Utilize the design of experiments and data analysis to optimize process

· Solve critical process issues and develop new fabrication techniques

Qualifications:

· MS or PhD in Electrical Engineering, Materials Science, Physics, or related fields

· Hands-on experience with semiconductor processing and wafer fabrication

· Experience with data mining and statistics, SPC and DOE.

· Ability to work in a cleanroom environment

· Basic knowledge of semiconductor lasers

· Excellent communication skills, able to collaborate with multi-functional teams

Hisense Photonics

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Process Integration Engineer